Silicon Design for Cortical Implants: Micro-Power Post-Quantum Circuits Under 1°C Thermal Limits

A silicon design analysis detailing how to implement post-quantum lattice cryptography within the strict micro-power and thermal boundaries of cortical brain implants.

Thermal Constraints on Cortical Surfaces

The human brain is exceptionally sensitive to thermal changes. Continuous heat dissipation exceeding 1°C causes localized inflammation, microglial activation, and neuronal apoptosis. Traditional cryptographic accelerators consuming hundreds of milliwatts cannot be placed on or inside the skull.

Asymmetric Cryptographic Partitioning

We present an asymmetric protocol architecture where the implant executes only lightweight encapsulation and symmetric stream ciphering, offloading the computationally intensive decapsulation and signature verification workloads to an external wearable relay worn behind the ear.

Packaging, Hermetic Cannulas, and Inductive Power Links

Mechanical engineering of biocompatible titanium and ceramic implant canisters, transcutaneous inductive power coils, and flexible polyimide electrode ribbons designed for lifetime stability.

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